Comparative study on effect of voids in thermal interface material layer on chip junction temperature of IGBT modules with and without baseplate
The emerging modules without baseplate are widely used in the field of new energy. They have high requirements for the coating of thermal interface material, but there are few related studies. In this paper, simulation research was conducted for the changing rule of the junction temperature of chip...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2023-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.012 |
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| Summary: | The emerging modules without baseplate are widely used in the field of new energy. They have high requirements for the coating of thermal interface material, but there are few related studies. In this paper, simulation research was conducted for the changing rule of the junction temperature of chips on IGBT modules with and without baseplate when the void ratio of the thermal interface material (TIM) is changing. A precise numerical model was established to carry out steady-state thermal simulation experiment. According to the results, quantitative analysis was conducted on the degree to which the chip junction temperature is affected by TIM voids on modules with and without baseplate. The results show that the chip junction temperature of the module with baseplate is lower than that of the module without baseplate, and the chip junction temperature is about 8.578 K and 9.544 K lower, respectively. When the void ratio of TIM layer increases, the junction temperature rise rate of the module without baseplate is greater than that of the module with baseplate, and the temperature rise rate of the large chip and the small chip of the module without baseplate is about 32.190 times and 240.875 times respectively that of the module with baseplate. The junction temperature rise rate of large chip is lower than that of small chip, which is about 23 times and 3 times, on modules with baseplate and without baseplate respectively. Modules without baseplate are more sensitive to the state of the TIM layer and have higher requirements. |
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| ISSN: | 1000-128X |