Comparative study on effect of voids in thermal interface material layer on chip junction temperature of IGBT modules with and without baseplate
The emerging modules without baseplate are widely used in the field of new energy. They have high requirements for the coating of thermal interface material, but there are few related studies. In this paper, simulation research was conducted for the changing rule of the junction temperature of chip...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2023-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.012 |
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