Comparison of Preprocessing Method Impact on the Detection of Soldering Splashes Using Different YOLOv8 Versions

Quality inspection of electronic boards during the manufacturing process is a crucial step, especially in the case of specific and expensive power electronic modules. Soldering splash occurrence decreases the reliability and electric properties of final products. This paper aims to compare different...

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Bibliographic Details
Main Authors: Peter Klco, Dusan Koniar, Libor Hargas, Marek Paskala
Format: Article
Language:English
Published: MDPI AG 2024-11-01
Series:Computation
Subjects:
Online Access:https://www.mdpi.com/2079-3197/12/11/225
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