Comparison of Preprocessing Method Impact on the Detection of Soldering Splashes Using Different YOLOv8 Versions
Quality inspection of electronic boards during the manufacturing process is a crucial step, especially in the case of specific and expensive power electronic modules. Soldering splash occurrence decreases the reliability and electric properties of final products. This paper aims to compare different...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-11-01
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| Series: | Computation |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-3197/12/11/225 |
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