Convex structure formation on a Cu substrate by friction stirring using a tool wrapped with Ti foil

The bond strength between Cu substrate and epoxy resin is required to be improved in power modules. Surface modification of the Cu substrate improves the bond strength due to the anchor effect. In this study, we propose a new surface modification method using friction stirring. A convex structure wa...

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Bibliographic Details
Main Authors: Hirosuke Sonomura, Kazuaki Katagiri, Tomoatsu Ozaki, Yasunori Hasegawa, Tsutomu Tanaka
Format: Article
Language:English
Published: Elsevier 2024-10-01
Series:Results in Surfaces and Interfaces
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Online Access:http://www.sciencedirect.com/science/article/pii/S2666845924001028
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