Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials
In foil has excellent heat dissipation performance as a commercially available thermal interface material for high power devices. In order to improve the heat transfer performance of In-based thermal interface materials, a composite thermal interface material with In as the matrix and Cu as the rein...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424029077 |
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