Emerging Copper-to-Copper Bonding Techniques: Enabling High-Density Interconnects for Heterogeneous Integration
As CMOS technology continues to downsize to the nanometer range, the exponential growth predicted by Moore’s Law has been significantly decelerated. Doubling chip density in the two-dimensional domain will no longer be feasible without further device downsizing. Meanwhile, emerging new device techno...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-05-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/15/10/729 |
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