Diamond thermal matrix demonstration for two-tier 3D integrated circuits
A diamond matrix scaffold is crucial for 3D dense chips because it provides exceptional thermal management due to its excellent thermal conductivity. Diamond can also replace copper thermal vias, enabling efficient heat transfer and improved cooling performance. Its low thermal boundary resistance w...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2025-04-01
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| Series: | APL Materials |
| Online Access: | http://dx.doi.org/10.1063/5.0260085 |
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