Investigation of the Visible Photocatalytic–Fenton Reactive Composite Polishing Process for Single-Crystal SiC Wafers Based on Response Surface Methodology

The third-generation semiconductor single-crystal silicon carbide (SiC), as a typical difficult-to-machine material, improves the chemical reaction rate on the SiC surface during the polishing process, which is key to realizing efficient chemical mechanical polishing (CMP). In this paper, a new core...

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Bibliographic Details
Main Authors: Zijuan Han, Bo Ran, Jisheng Pan, Rongji Zhuang
Format: Article
Language:English
Published: MDPI AG 2025-03-01
Series:Micromachines
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Online Access:https://www.mdpi.com/2072-666X/16/4/380
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