Mechanical Modelling of Integration and Debonding Process of Ultra-Thin Inorganic Chips
The research on ultra-thin inorganic chips is an important field in the development of inorganic flexible electronics. By thinning the inorganic (mainly silicon-based) chip to less than 50 μm, it will gain a certain degree of flexibility. After the ultra-thin chip is integrated into the flexible sub...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-07-01
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| Series: | Inorganics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2304-6740/13/7/234 |
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