Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration
This paper examined the reliability of complex PCB assemblies under random vibration and temperature cycling, which are two primary causes of assembly failure. A combination of finite element simulation and environmental testing was employed to investigate the effects of different reinforcement meth...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-02-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/2/212 |
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