Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafer CMP for Direct Wafer Bonding Applications

Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafer CMP for Direct Wafer Bonding Applications

We investigated the tribological, thermal, kinetic, and surface microtextural characteristics of chemical mechanical polishing (CMP) of 300 mm p-type <100> prime silicon wafers (and their native oxide) at various pressures, sliding velocities, and starting platen temperatures. Results showed t...

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Bibliographic Details
Main Authors: Michelle Yap, Catherine Yap, Yasa Sampurno, Glenn Whitener, Jason Keleher, Len Borucki, Ara Philipossian
Format: Article
Language:English
Published: MDPI AG 2025-01-01
Series:Electronic Materials
Subjects:
chemical mechanical polishing
silicon polish
native oxide polish
Online Access:https://www.mdpi.com/2673-3978/6/1/1
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