Evaluation of Leakage Currents of Semiconductor Packages Due to High-Voltage Stress Under an Immersion Cooling Environment

Evaluation of Leakage Currents of Semiconductor Packages Due to High-Voltage Stress Under an Immersion Cooling Environment

As data centers expand, immersion cooling systems are gaining attention for thermal management of memory devices. To enable widespread adoption, it is essential to evaluate the impact of coolants on the reliability of memory packages. In this study, high-voltage direct current (DC) stress tests were...

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Bibliographic Details
Main Authors: Kyuhae Min, Taejun Kang, Tae Yeob Kang, Jae-Bum Pyo
Format: Article
Language:English
Published: MDPI AG 2025-04-01
Series:Applied Sciences
Subjects:
semiconductor package
high voltage stress test
immersion cooling
mechanical behavior
leakage current
reliability
Online Access:https://www.mdpi.com/2076-3417/15/9/4668
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