Ultrafast laser nanostructuring and its application in electrochemical deposition of metal microstructures with high density and robust bonding strength by Jinlong Xu, Wanfei Ren, Aobo Zhang, Fuliang Wang, Jinkai Xu, Guodong Zhang, Guanghua Cheng

“…The hardness and elastic modulus of the deposited copper were tested to be 0.95 GPa and 67.99 GPa, respectively, approaching those of forged copper. For microstructure arrays on a centimeter scale, the electrodeposition time can be reduced from hundreds of hours to tens of minutes. …”
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Current Status and Future Perspectives of the COBRA Experiment by J. Ebert, M. Fritts, C. Gößling, T. Göpfert, D. Gehre, C. Hagner, N. Heidrich, T. Köttig, T. Neddermann, C. Oldorf, T. Quante, S. Rajek, O. Reinecke, O. Schulz, J. Tebrügge, J. Timm, B. Wonsak, K. Zuber

“…For this purpose a detector array made of cadmium-zinc-telluride (CdZnTe) semiconductor detectors is operated at the Gran Sasso Underground Laboratory (LNGS) in Italy. …”
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Sub-surface processes and heat fluxes at coarse blocky Murtèl rock glacier (Engadine, eastern Swiss Alps): seasonal ice and convective cooling render rock glaciers climate-robust by D. Amschwand, D. Amschwand, J. Wicky, M. Scherler, M. Hoelzle, B. Krummenacher, A. Haberkorn, C. Kienholz, H. Gubler

“…<p>We measured sub-surface heat fluxes and calculated the energy budget of the coarse blocky active layer (AL) of Murtèl rock glacier, a seasonally snow-covered permafrost landform located in the eastern Swiss Alps. …”
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Degradation of Ciprofloxacin Antibiotic Waste Using TiO2 Nanotube with Addition of Anthocyanin Dye-Sensitizer In Photocatalysis Process: Review by Fidarohman Fidarohman, Fidarohman Fidarohman, Berliana Tristati Putri, Berliana Tristati Putri, Martina Reza Putri, Martina Reza Putri, Indar Kustiningsih, Slamet Slamet, Slamet Slamet

“…To improve the performance of TiO₂ photocatalyst, morphological engineering is carried out to form TiO₂ nanotube arrays and then coated with natural anthocyanin sensitizer. …”
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Solution-based manufacturing of 2D materials for memristive device applications by Kijeong Nam, Gwang Ya Kim, Dongjoon Rhee, Hyesung Park, Deep Jariwala, Joohoon Kang

“…In addition, low-temperature integration for complementary metal oxide semiconductor (CMOS) back-end-of-line (BEOL) integration is important for embedded memory applications. …”
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