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A Chisel Generator for Standardized 3-D Die-to-Die Interconnects
Published 2024-01-01“…Technology-driven constraints highlighted in published works demonstrate that a unique approach to 3-D D2D interconnect design and implementation is required, while preserving the ability to customize the interconnect to accommodate future technology concerns and applications with minimal overhead. This article presents a framework to generate customized 3-D D2D interconnect physical layers (PHYs) that are simultaneously standard-compliant, physical-aware, and can be automatically integrated into all stacked chiplets. …”
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2203
Development and Test of Pomelo Fruit Inventory Grading Management System Based on RFID Technology
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Editorial
Published 2025-05-01“… Yang Zhang, Ziwen Wei, Zhihua Liu, Xiaolong Wu and Junchao Qian from China introduce in their study a cost-effective and highly accurate method for recognizing patient postures during radiotherapy based on stacked grayscale 3-channel images. Enjoy Reading!…”
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Investigation of temperature dependent current-voltage characteristics of Ba0.5Sr0.5TiO3 thin films
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Ceramic based 3D integration technology of integrated navigation microsystem
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USING THE KARHUNEN-LOÈVE TRANSFORM TO SUPPRESS GROUND ROLL IN SEISMIC DATA
Published 2005-08-01Get full text
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Microstructures, Mineral Compositions, and Mechanical Properties of Red-Layers in Southern China
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Genome-wide identification and analysis of recurring patterns of epigenetic variation across individuals
Published 2025-06-01Get full text
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Persistent Heterogeneities in the Oceanic Lithosphere Due To Differential Freezing Beneath Ridges
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Lattice bond chains administer kink anisotropy and inform strategies of theophylline crystal self-healing
Published 2025-07-01Get full text
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