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    A Chisel Generator for Standardized 3-D Die-to-Die Interconnects by Harrison Liew, Farhana Sheikh, Jong-Ru Guo, Zuoguo Wu, Borivoje Nikolic

    Published 2024-01-01
    “…Technology-driven constraints highlighted in published works demonstrate that a unique approach to 3-D D2D interconnect design and implementation is required, while preserving the ability to customize the interconnect to accommodate future technology concerns and applications with minimal overhead. This article presents a framework to generate customized 3-D D2D interconnect physical layers (PHYs) that are simultaneously standard-compliant, physical-aware, and can be automatically integrated into all stacked chiplets. …”
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    Editorial by Christian Gütl

    Published 2025-05-01
    “… Yang Zhang, Ziwen Wei, Zhihua Liu, Xiaolong Wu and Junchao Qian from China introduce in their study a cost-effective and highly accurate method for recognizing patient postures during radiotherapy based on stacked grayscale 3-channel images. Enjoy Reading!…”
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