Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly by 覃荣震, 张泉

Subjects: “…wire bonding…”
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Research on Silver Sintering Process and Wire Bonding Process of IGBT Module by Haoliang ZHANG, Jie FANG, Ninghua XU

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The current induced mass transformation of Ag alloy wire bonded led chip by Xiaohong Yuan, Qinlian He, Shanju Zheng, Jiaheng Zhang, Dapeng Yang, Qinsong Bi, Yuxi Luo, Dengquan Chen, Xiaojing Wang

Subjects: “…Ag wire bonding…”
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Optimization design on process parameters of copper wire bonding for power modules by HU Biao, CHENG Lanxian, LI Zhenling, DAI Xiaoping

Subjects: “…copper wire bonding…”
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Research on advanced interconnection processes for SiC power device by DU Longchun, HE Yong, LIU Hongwei, LIU Xiaopeng

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Investigation into the evolution and failure mechanism of IMCs in Au wire bond interconnections under long-term wet heat conditions by Yaru Wu, Qinsong Bi, Shumeng Lu, Hongfu Yang, Shanju Zheng, Xiaohong Yuan, Jiaheng Zhang, Xiaojing Wang, Mengnie Li

Subjects: “…Au wire bonding…”
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Study on Power Cycling Lifetime of Automotive IGBT Devices by Wangjun ZHOU, Jinhui LU, Haihui LUO, Xiang TANG, Chao FANG, Haotao KE, Yongdian PENG

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A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package by Jisu Lim, Wonbin Kim, Suk Jekal, Jiwon Kim, Ha-Yeong Kim, Zambaga Otgonbayar, Jeoung Han Kim, Jinsung Rho, Woo-Jin Song, Chang-Min Yoon

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Modelling the fatigue damage in power components using machine learning technology by Stoyan Stoyanov, Razia Sulthana, Tim Tilford, Xiaotian Zhang, Yihua Hu, Xingyu Yang, Yaochun Shen, Yangang Wang

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