Surdat: Database of physical properties of lead-free solders by Moser Z., Gasior W., Debski A., Pstrus J.

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Thermodynamic properties of the liquid Bi-Cu-Sn lead-free solder alloys by Kopyto M., Garzel G., Zabdyr L.A.

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Interfacial reactions between solid Ni and liquid Sn-Zn alloys by Gandova V.

Subjects: “…solders…”
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Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys by Garzel G., Kopyto M., Zabdyr L.A.

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COST531 project: Study of the advanced materials for lead free soldering by Kroupa A., Dinsdale A.T., Watson A., Vrestal J., Zemanova A.

Subjects: “…lead-free solders…”
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Ni-Bi-Zn ternary system investigation using diffusion couples technique by Gandova V.D.

Subjects: “…solders…”
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Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders by Soares D., Barbosa J., Vilarinho C.

Subjects: “…lead-free solders…”
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Phase relations near ternary eutectic point in the Ag-In-Sb system by Jendrzejczyk-Handzlik D., Živković Dragana, Gierlotka W., Manasijević D., Fitzner K., Minić D.

Subjects: “…lead-free solders…”
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Supplementary X-ray studies of the Ni-Sn-Bi system by Vassilev G.P., Lilova K.I., Gachon J.C.

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Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance by Tomas Melus, Roman Kolenak, Jaromir Drapala, Mikulas Sloboda, Peter Gogola, Matej Pasak

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Surface properties and wetting behavior of liquid Ag-Sb-Sn alloys by Sklyarchuk V., Plevachuka Yu., Kaban I., Novakovic R.

Subjects: “…lead-free solders…”
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Effect of rare earth Ce on the microstructure, physical properties and thermal stability of a new lead-free solder by Chen W., Kong J., Chen W.J.

Subjects: “…lead-free solders…”
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The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system by Pstruś J.

Subjects: “…lead-free solders…”
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Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates by Soares D., Vilarinho C., Barbosa J., Samuel F., Trigo L., Bré P.

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Size-dependent thermodynamic description of the binary Pb-Sn system by Gierlotka W.

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A new thermodynamic description of the binary Sb-Zn system by Gierlotka W.

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On the synthesis of Bi-based precursors for lead-free solders development by Gandova V., Lilova K., Malakova H., Huber B., Milcheva N., Ipser H., Vrestal J., Vassilev G.

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Investigation of dissolution resistance of blank and gas-nitrided carbon steels in stationary SAC305 solder alloy melt by Benke M., Salyi Zs., Kaptay G.

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Thermodynamic analysis and characterization of alloys in Bi-Cu-Sb system by Živković D., Minić D., Manasijević D., Kostov A., Talijan N., Balanović Lj., Mitovski A., Živković Ž.

Subjects: “…kead-free solder materials…”
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Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders by Ohnuma I., Kainuma R., Ishida K.

Subjects: “…high-tepmerature Pb-free solder…”
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