Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance by Tomas Melus, Roman Kolenak, Jaromir Drapala, Mikulas Sloboda, Peter Gogola, Matej Pasak

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Investigation of dissolution resistance of blank and gas-nitrided carbon steels in stationary SAC305 solder alloy melt by Benke M., Salyi Zs., Kaptay G.

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THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD by WANG WeiYin, WU ZhaoHua, CHEN GuDi, WANG ZhiQi, CHEN XiaoYong

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Investigation of temperature homogeneity during infrared soldering of silicon solar cells using the finite element method by Joseph Daniel Christopher, De Rose Angela, Eberlein Dirk, Parlayan Onur, Grübel Benjamin, Beinert Andreas J., Neuhaus Holger

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Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling by Ramiro Sebastian Vargas Cruz, Viktor Gonda

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Influence of Aging Processes on the Characteristics of Power LEDs Soldered Using Composite Solder Pastes by Krzysztof Górecki, Przemysław Ptak, Agata Skwarek

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Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints by Yuming Wang, Keke Zhang, Chao Zhang, Fupeng Huo, Yijie Gao

Subjects: “…Sn2.5Ag0.7Cu0.1RE soldering metal…”
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Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates by Soares D., Vilarinho C., Barbosa J., Samuel F., Trigo L., Bré P.

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Size-dependent thermodynamic description of the binary Pb-Sn system by Gierlotka W.

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A new thermodynamic description of the binary Sb-Zn system by Gierlotka W.

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Surdat: Database of physical properties of lead-free solders by Moser Z., Gasior W., Debski A., Pstrus J.

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Thermodynamic properties of the liquid Bi-Cu-Sn lead-free solder alloys by Kopyto M., Garzel G., Zabdyr L.A.

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Interfacial reactions between solid Ni and liquid Sn-Zn alloys by Gandova V.

Subjects: “…solders…”
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Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys by Garzel G., Kopyto M., Zabdyr L.A.

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COST531 project: Study of the advanced materials for lead free soldering by Kroupa A., Dinsdale A.T., Watson A., Vrestal J., Zemanova A.

Subjects: “…lead-free solders…”
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SOLDERE HAVZASININ JEOMORFOLOJİK ÖZELLİKLERİNE MORFOMETRİK YAKLAŞIM: JEOMORFİK İNDİSLER İLE BİR UYGULAMA by A. Evren Erginal, İsa Cürebal

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Ni-Bi-Zn ternary system investigation using diffusion couples technique by Gandova V.D.

Subjects: “…solders…”
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Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition by Xiangxia Kong, Zuchen Liu, Ruipeng Ma, Junjun Zhai, Zhen Pan, Xuemei Li, Fenglian Sun

Subjects: “…Composite solder joint…”
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Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders by Soares D., Barbosa J., Vilarinho C.

Subjects: “…lead-free solders…”
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Phase relations near ternary eutectic point in the Ag-In-Sb system by Jendrzejczyk-Handzlik D., Živković Dragana, Gierlotka W., Manasijević D., Fitzner K., Minić D.

Subjects: “…lead-free solders…”
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