Research of joining the SiC and Cu combination by use of SnTi solder filled with SiC nanoparticles and with active ultrasound assistance by Tomas Melus, Roman Kolenak, Jaromir Drapala, Mikulas Sloboda, Peter Gogola, Matej Pasak

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Investigation of dissolution resistance of blank and gas-nitrided carbon steels in stationary SAC305 solder alloy melt by Benke M., Salyi Zs., Kaptay G.

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Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling by Ramiro Sebastian Vargas Cruz, Viktor Gonda

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Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints by Yuming Wang, Keke Zhang, Chao Zhang, Fupeng Huo, Yijie Gao

Subjects: “…Sn2.5Ag0.7Cu0.1RE soldering metal…”
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Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates by Soares D., Vilarinho C., Barbosa J., Samuel F., Trigo L., Bré P.

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Size-dependent thermodynamic description of the binary Pb-Sn system by Gierlotka W.

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A new thermodynamic description of the binary Sb-Zn system by Gierlotka W.

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Surdat: Database of physical properties of lead-free solders by Moser Z., Gasior W., Debski A., Pstrus J.

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Thermodynamic properties of the liquid Bi-Cu-Sn lead-free solder alloys by Kopyto M., Garzel G., Zabdyr L.A.

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Interfacial reactions between solid Ni and liquid Sn-Zn alloys by Gandova V.

Subjects: “…solders…”
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Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys by Garzel G., Kopyto M., Zabdyr L.A.

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COST531 project: Study of the advanced materials for lead free soldering by Kroupa A., Dinsdale A.T., Watson A., Vrestal J., Zemanova A.

Subjects: “…lead-free solders…”
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Ni-Bi-Zn ternary system investigation using diffusion couples technique by Gandova V.D.

Subjects: “…solders…”
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Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders by Soares D., Barbosa J., Vilarinho C.

Subjects: “…lead-free solders…”
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Phase relations near ternary eutectic point in the Ag-In-Sb system by Jendrzejczyk-Handzlik D., Živković Dragana, Gierlotka W., Manasijević D., Fitzner K., Minić D.

Subjects: “…lead-free solders…”
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Thermodynamic analysis and characterization of alloys in Bi-Cu-Sb system by Živković D., Minić D., Manasijević D., Kostov A., Talijan N., Balanović Lj., Mitovski A., Živković Ž.

Subjects: “…kead-free solder materials…”
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Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders by Ohnuma I., Kainuma R., Ishida K.

Subjects: “…high-tepmerature Pb-free solder…”
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Supplementary X-ray studies of the Ni-Sn-Bi system by Vassilev G.P., Lilova K.I., Gachon J.C.

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Effect of additive elements Bi/Ni/Ge on crack initiation and propagation for low-Ag solders by Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono

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Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation by Yuezong Zheng, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, Abdullah Aziz Saad

Subjects: “…Lead-free solder…”
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