Thermodynamic analysis and characterization of alloys in Bi-Cu-Sb system by Živković D., Minić D., Manasijević D., Kostov A., Talijan N., Balanović Lj., Mitovski A., Živković Ž.

Subjects: “…kead-free solder materials…”
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Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders by Ohnuma I., Kainuma R., Ishida K.

Subjects: “…high-tepmerature Pb-free solder…”
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Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module by Dianhao Zhang, Xiao-guang Huang, Bin-liang Cheng, Neng Zhang

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Supplementary X-ray studies of the Ni-Sn-Bi system by Vassilev G.P., Lilova K.I., Gachon J.C.

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Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders by Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono

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Effect of additive elements Bi/Ni/Ge on crack initiation and propagation for low-Ag solders by Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono

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Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation by Yuezong Zheng, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, Abdullah Aziz Saad

Subjects: “…Lead-free solder…”
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RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT by CU QiangYi, LIU ZhiHu, TIAN Feng, ZHANG FengHua, ZHAO Gang, WU Bo

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Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue by Junjie Zhao, Jun Wu, Jiayu Zhang, Mingqin Liao, Fengjiang Wang

Subjects: “…Sn-Ag-Cu solder…”
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ESTIMATION OF THERMAL PARAMETERS OF POWER BIPOLAR TRANSISTORS BY THE METHOD OF THERMAL RELAXATION DIFFERENTIAL SPECTROMETRY by V. S. Niss, A. S. Vaskou, A. S. Turtsevich, A. F. Kerentsev, V. K. Kononenko

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Design of Ag-Ge-Zn braze/solder alloys: Experimental thermodynamics and surface properties by Delsante S., Li D., Novakovic R., Borzone G.

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Surface properties and wetting behavior of liquid Ag-Sb-Sn alloys by Sklyarchuk V., Plevachuka Yu., Kaban I., Novakovic R.

Subjects: “…lead-free solders…”
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Effect of rare earth Ce on the microstructure, physical properties and thermal stability of a new lead-free solder by Chen W., Kong J., Chen W.J.

Subjects: “…lead-free solders…”
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STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE by LIN XunChao, LIANG Ying

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FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION by HUA JianWei, HUANG ChunYue, LIANG Ying, HUANG Wei, ZHANG Long

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The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system by Pstruś J.

Subjects: “…lead-free solders…”
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STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING by LIANG Ying, HUANG ChunYue, YIN Rui, HUANG Wei, LI TianMing, ZHAO HongWang

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On the synthesis of Bi-based precursors for lead-free solders development by Gandova V., Lilova K., Malakova H., Huber B., Milcheva N., Ipser H., Vrestal J., Vassilev G.

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