Interfacial reactions between solid Ni and liquid Sn-Zn alloys by Gandova V.

Subjects: “…solders…”
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Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys by Garzel G., Kopyto M., Zabdyr L.A.

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COST531 project: Study of the advanced materials for lead free soldering by Kroupa A., Dinsdale A.T., Watson A., Vrestal J., Zemanova A.

Subjects: “…lead-free solders…”
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SOLDERE HAVZASININ JEOMORFOLOJİK ÖZELLİKLERİNE MORFOMETRİK YAKLAŞIM: JEOMORFİK İNDİSLER İLE BİR UYGULAMA by A. Evren Erginal, İsa Cürebal

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Investigation of dissolution resistance of blank and gas-nitrided carbon steels in stationary SAC305 solder alloy melt by Benke M., Salyi Zs., Kaptay G.

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Ni-Bi-Zn ternary system investigation using diffusion couples technique by Gandova V.D.

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Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders by Soares D., Barbosa J., Vilarinho C.

Subjects: “…lead-free solders…”
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Phase relations near ternary eutectic point in the Ag-In-Sb system by Jendrzejczyk-Handzlik D., Živković Dragana, Gierlotka W., Manasijević D., Fitzner K., Minić D.

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Supplementary X-ray studies of the Ni-Sn-Bi system by Vassilev G.P., Lilova K.I., Gachon J.C.

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THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD by WANG WeiYin, WU ZhaoHua, CHEN GuDi, WANG ZhiQi, CHEN XiaoYong

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Investigation of temperature homogeneity during infrared soldering of silicon solar cells using the finite element method by Joseph Daniel Christopher, De Rose Angela, Eberlein Dirk, Parlayan Onur, Grübel Benjamin, Beinert Andreas J., Neuhaus Holger

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Surface properties and wetting behavior of liquid Ag-Sb-Sn alloys by Sklyarchuk V., Plevachuka Yu., Kaban I., Novakovic R.

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Effect of rare earth Ce on the microstructure, physical properties and thermal stability of a new lead-free solder by Chen W., Kong J., Chen W.J.

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The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system by Pstruś J.

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Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling by Ramiro Sebastian Vargas Cruz, Viktor Gonda

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Influence of Aging Processes on the Characteristics of Power LEDs Soldered Using Composite Solder Pastes by Krzysztof Górecki, Przemysław Ptak, Agata Skwarek

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Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints by Yuming Wang, Keke Zhang, Chao Zhang, Fupeng Huo, Yijie Gao

Subjects: “…Sn2.5Ag0.7Cu0.1RE soldering metal…”
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On the synthesis of Bi-based precursors for lead-free solders development by Gandova V., Lilova K., Malakova H., Huber B., Milcheva N., Ipser H., Vrestal J., Vassilev G.

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