Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste by Young-Min Ju, Tae-Wan Kim, Seung-Hyun Lee, Ho-Jin Lee, Jinho Ahn, Hak-Sung Kim

Subjects: “…Wideband gap semiconductor package…”
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Evaluation of Leakage Currents of Semiconductor Packages Due to High-Voltage Stress Under an Immersion Cooling Environment by Kyuhae Min, Taejun Kang, Tae Yeob Kang, Jae-Bum Pyo

Subjects: “…semiconductor package…”
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Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model by Jeong-Hyeon Park, Jaechoon Kim, Sukwon Jang, Sungho Mun, Eun-Ho Lee

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Digital Twin for Developing and Verifying Semiconductor Packaging License Models by Lai-Chung Lee, Shou-Yen Zhao, Whei-Jane Wei

Subjects: “…mixed reality semiconductor packaging…”
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Enhanced Simulation Accuracy and Design Optimization in Power Semiconductors Through Individual Aluminum Metallization Layer Modeling by Na-Yeon Choi, Sang-Gi Kim, Sung-Uk Zhang

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A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package by Jisu Lim, Wonbin Kim, Suk Jekal, Jiwon Kim, Ha-Yeong Kim, Zambaga Otgonbayar, Jeoung Han Kim, Jinsung Rho, Woo-Jin Song, Chang-Min Yoon

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