Research progress in the relationship between packaging structures and service performance of MEMS inertial sensors by Zhaoyang Liu, Xu Yang, Yongjun Jia, Yanshun Zhang, Yang Pang, Xiaojuan Huang

Subjects: “…packaging structure…”
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A 3D DC Electric Field Meter Based on Sensor Chips Packaged Using a Highly Sensitive Scheme by Pengfei Yang, Xiaolong Wen, Xiaonan Li, Zhaozhi Chu, Chunrong Peng, Shuang Wu

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Mechanical response identification of local interconnections in board-level packaging structures under projectile penetration using Bayesian regularization by Xu Long, Yuntao Hu, Irfan Ali

Subjects: “…Board-level packaging structure…”
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Package Structure Design of IGCT Wafer by ZENG Wenbin, YAN Ji, REN Yadong, CHEN Fanglin, PAN Xuejun

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A Novel Seal Packaging Structure Applied in Sub Miniature Push-On Connector Based on Ni47Ti44Nb9 Shape Memory Alloy Seal Ring by Yang Hai, Cong Lu

Subjects: “…Seal packaging structure…”
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Power Cycling Capability and Reliability Test of IGBT Modules by LI Shiping, HUANG Rong, FENG Qin, WAN Chaoqun, CHEN Yan

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