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  1. 1
    Integrating Tier-1 module suppliers in car sequencing problem

    Integrating Tier-1 module suppliers in car sequencing problem by Emrae Jung

    Published 2021-07-01
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  2. 2
    Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly

    Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly by 覃荣震, 张泉

    Published 2011-01-01
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