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1
Digital Etching of Molybdenum Interconnects Using Plasma Oxidation
Published 2025-01-01Subjects: Get full text
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2
Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging
Published 2024-01-01Subjects: Get full text
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3
Energy-/Carbon-Aware Evaluation and Optimization of 3-D IC Architecture With Digital Compute-in-Memory Designs
Published 2024-01-01Subjects: “…3-D integrated circuit (IC)…”
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