Showing 1 - 20 results of 189 for search '"integrated circuit"', query time: 0.08s Refine Results
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    Operational Amplifiers and Linear Integrated Circuits / by Boyce, Jefferson C.

    Published 1988
    Subjects:
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    Book
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    Metamaterial CRLH Antennas on Silicon Substrate for Millimeter-Wave Integrated Circuits by Gheorghe Ioan Sajin, Iulia Andreea Mocanu

    Published 2012-01-01
    “…It is, upon the authors' knowledge, the first report of millimeter wave CRLH antennas on silicon substrate in CPW technique for use in mm-wave monolithic integrated circuit.…”
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    Article
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    EQUIPMENT FOR NONDESTRUCTIVE TESTING OF SILICON WAFERS SUBMICRON TOPOLOGY DURING THE FABRICATION OF INTEGRATED CIRCUITS by S. A. Chizhik, S. P. Basalaev, V. A. Pilipenko, A. L. Khudoley, T. A. Kuznetsova, V. V. Chikunov, A. A. Suslov

    Published 2015-03-01
    “…The advantages of using an atomic force microscopy in manufacturing of submicron integrated circuits are described. The possibilities of characterizing the surface morphology and the etching profile for silicon substrate and bus lines, estimation of the periodicity and size of bus lines, geometrical stability for elementary bus line are shown. …”
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    Article
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    Monitoring the reliability of integrated circuits protection against Trojans: encoding and decoding of combinational structures by L. A. Zolotorevich, V. A. Ilyinkov

    Published 2021-09-01
    “…Integrated circuits, systems on a chip are the key links in various industrial systems and state defense systems. …”
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    Article
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    Temperature Monitoring in PIC Surface by Sushma Pandey, Antonio Teixeira, Mario Lima

    Published 2025-01-01
    Subjects: “…photonics integrated circuit…”
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    Article
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    Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits by Peng Xu, Huan Huang, Songjie Zhao, Xiushan Liu, Fa Zou, Chao Li, Jun Ai, Hui Liu

    Published 2025-02-01
    “…This paper proposed the carbon materials (including MLGNR, MWCNT and SWCNT) to replace the traditional Cu as the filler of through silicon via (TSV) for enhancing heat transfer performance of three-dimensional integrated circuits (3-D ICs), meanwhile the corresponding mathematical model is established to quickly obtain steady-state temperature of each die layer. …”
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    Article
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    Graph-Based Symbolic Technique and Its Application in the Frequency Response Bound Analysis of Analog Integrated Circuits by E. Tlelo-Cuautle, S. Rodriguez-Chavez, A. A. Palma-Rodriguez

    Published 2014-01-01
    “…A new graph-based symbolic technique (GBST) for deriving exact analytical expressions like the transfer function H(s) of an analog integrated circuit (IC), is introduced herein. The derived H(s) of a given analog IC is used to compute the frequency response bounds (maximum and minimum) associated to the magnitude and phase of H(s), subject to some ranges of process variational parameters, and by performing nonlinear constrained optimization. …”
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    Article
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    Microwave Imaging Using CMOS Integrated Circuits with Rotating 4 × 4 Antenna Array on a Breast Phantom by Hang Song, Afreen Azhari, Xia Xiao, Eiji Suematsu, Hiromasa Watanabe, Takamaro Kikkawa

    Published 2017-01-01
    “…A digital breast cancer detection system using 65 nm technology complementary metal oxide semiconductor (CMOS) integrated circuits with rotating 4 × 4 antenna array is presented. …”
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    Article
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