Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies by Pallavi Praful, Chris Bailey

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Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application by Sangwoo Park, Sangmin Lee, Junyoung Choi, Sarah Eunkyung Kim

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Enhanced thermal dissipation for BCB-bonded 3D integrated membrane photonic circuits by Salim Abdi, Kevin Williams, Yuqing Jiao

Subjects: “…heterogeneous integration…”
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A Heterogeneously Integrated 256-Element 5G Phased Array: Design, Assembly, Test by Bodhisatwa Sadhu, Arun Paidimarri, Atom O. Watanabe, Duixian Liu, Xiaoxiong Gu, Christian W. Baks, Yujiro Tojo, Yoshiharu Fujisaku, Isabel De Sousa, Yo Yamaguichi, Ning Guan, Alberto Valdes-Garcia

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Design and optimization of high-contrast gratings for multispectral VCSEL-SOI laser sources by I.S. Shashkin, M.I. Kondratov, A.E. Grishin, K.E. Pevchikh, S.O. Slipchenko, N.A. Pikhtin

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Co-Optimization of Power Delivery Network Design for 3-D Heterogeneous Integration of RRAM-Based Compute In-Memory Accelerators by Madison Manley, James Read, Ankit Kaul, Shimeng Yu, Muhannad Bakir

Subjects: “…3-D heterogeneous integration (3D-HI)…”
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