Research on Lifespan Prediction Methods Using Ultrasonic Microimaging for Electronic Packaging by Haotian Wang, Hongwei Ma, Guangming Zhang, Yuan Chen, Ming Dong

Subjects: “…electronic packaging…”
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Review on the impact of marine environment on the reliability of electronic packaging materials by Fengyong Lang, Zhenrui Zhou, Jia Liu, Meng Cui, Zhongqing Zhang

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An analytical review on interfacial reactions in high-temperature die-attach: the insights into the effect of surface metallization and filler materials by Liu Canyu, Liu Changqing

Subjects: “…high-temperature electronics packaging…”
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Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials by Zhenrui Zhou, Fengyong Lang, Vincentius Farlim, Zhongqing Zhang, Shiyang Li, Ruipeng Dong

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Electronics packaging materials and component-level degradation monitoring by Adwait Inamdar, Willem D. Van Driel, GuoQi Zhang

Subjects: “…electronics packaging…”
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Nonlinear Elastoplastic Response and Damage Modeling in Power Electronics Packages Under Thermal Cycling by Giuseppe Mirone, Raffaele Barbagallo, Luca Corallo, Giuseppe Bua, Guido La Rosa, Giovanna Fargione, Fabio Giudice

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