Single- and Multi-Network Hydrogels for Soft Electronics—A Review by Md Murshed Bhuyan, Nahid Hasan, Jae-Ho Jeong

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Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering by Lei Yan, Zongguang Liu, Junzhuan Wang, Linwei Yu

Subjects: “…Soft electronics…”
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A Soft Capacitive Pressure Sensor Based on a Liquid Dielectric Layer by Meng Zhang, Chengjie Qiu, Jianxiang Wang, Xuan Huang, Wu Zhang, Lip-Ket Chin, Wenli Shang

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Soft, Stretchable, High-Sensitivity, Multi-Walled Carbon Nanotube-Based Strain Sensor for Joint Healthcare by Zechen Guo, Xiaohe Hu, Yaqiong Chen, Yanwei Ma, Fuqun Zhao, Sheng Guo

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Intrinsically Soft Implantable Electronics for Long‐term Biosensing Applications by Su Hyeon Lee, Hyo Jin Lee, Sohye Lee, Dae‐Hyeong Kim, Hye Jin Kim, Sung‐Hyuk Sunwoo

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Highly Stretchable, Low Hysteresis, and Transparent Ionogels as Conductors for Dielectric Elastomer Actuators by Limei Zhang, Hong Li, Zhiquan Li, Weimin Pan, Yi Men, Niankun Zhang, Jing Xu, Xuewei Liu

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Recent Achievements of Epicardial Patch Electronics Using Adhesive and Conductive Hydrogels by Su Hyeon Lee, Jong Won Lee, Daehyeon Kim, Gi Doo Cha, Sung-Hyuk Sunwoo

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Self‐Maintainable Electronic Materials with Skin‐Like Characteristics Enabled by Graphene‐PEDOT:PSS Fillers by Morteza Alehosseini, Firoz Babu Kadumudi, Sinziana Revesz, Parham Karimi Reikandeh, Jonas Rosager Henriksen, Tiberiu‐Gabriel Zsurzsan, Jon Spangenberg, Alireza Dolatshahi‐Pirouz

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Wireless, Multifunctional System-Integrated Programmable Soft Robot by Sungkeun Han, Jeong-Woong Shin, Joong Hoon Lee, Bowen Li, Gwan-Jin Ko, Tae-Min Jang, Ankan Dutta, Won Bae Han, Seung Min Yang, Dong-Je Kim, Heeseok Kang, Jun Hyeon Lim, Chan-Hwi Eom, So Jeong Choi, Huanyu Cheng, Suk-Won Hwang

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Direct-ink-writing of highly deformable, multi-layered electrical devices using elastomer-based dual inks by Jung Hyun Kim, Huy Le Quang, Ho Hyung Sim, Jun Chang Yang, Jaeyeon Pyo, Min Woo Kim, Seung Kwon Seol

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3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics by Chengjun Zhang, Qing Yang, Haoyu Li, Zexiang Luo, Yu Lu, Jialiang Zhang, Cheng Li, Feng Chen

Subjects: “…3D soft electronics…”
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A Waterborne, Flexible, and Highly Conductive Silver Ink for Ultra-Rapid Fabrication of Epidermal Electronics by Patrick Rwei, Jia-Wei Shiu, Mehmet Senel, Amirhossein Hajiaghajani, Chengyang Qian, Chin-Wen Chen, Peter Tseng, Michelle Khine

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Soft Electronic Switches and Adaptive Logic Gates Based on Nanostructured Gold Networks by Giacomo Nadalini, Alexander Dallinger, Davide Sottocorno, Francesco Greco, Francesca Borghi, Paolo Milani

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