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  1. 1
    Electromigration failure induced by interdiffusion between Al trace and Cu seed layer in the immortal microbump in three-dimensional integrated circuit

    Electromigration failure induced by interdiffusion between Al trace and Cu seed layer in the immortal microbump in three-dimensional integrated circuit by Yifan Yao, Yuxuan An, K.N. Tu, Yingxia Liu

    Published 2025-05-01
    Subjects: “…Microbump…”
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  2. 2
    Frequency-comb-referenced multiwavelength interferometry for high-precision and high-speed 3D measurement in heterogeneous semiconductor packaging

    Frequency-comb-referenced multiwavelength interferometry for high-precision and high-speed 3D measurement in heterogeneous semiconductor packaging by Park Jun Hyung, Kim Dae Hee, Chu Huy Hoang, Hahm Ji Won, Kang Guseon, Lee Dongil, Song Seyong, Kang Mingu, Kim Seung-Woo, Kim Young-Jin

    Published 2025-02-01
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