Investigation of Contact Properties and Device Performance for Bifacial Double-Side Textured Silicon Solar Cells With Polysilicon Based Passivating Contacts by Pradeep Padhamnath, John Derek D. Arcebal, Sagnik Dasgupta, Gabby De Luna, Ajeet Rohatgi, Armin G. Aberle

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PECVD SixCy as Barrier Layer Against Aluminum in Solar Cells With poly-Si/SiOx Passivating Contacts by David Bäurle, Benjamin Gapp, Giso Hahn, Heiko Plagwitz, Barbara Terheiden

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Influence of Electrodes Configuration on Metallized Film Capacitor Performance Metrics by Belko V.O., Cheng Lu, Kalmykova S.I., Pechnikov A.V., Plotnikov A.P.

Subjects: “…metallized film capacitor…”
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Estimation of diffusion behaviour of metals used for the creation of multilayered contacts to heterostructures based on GaAs by V. V. Arbenina, A. S. Kashuba, E. V. Permikina

Subjects: “…metallization, interphase boundaries, microstructure, polycrystalline layers, diffusion.…”
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Research progress on deposition mechanism of ceramic metallization by cold spraying by QIN Jia-hao, FANG Kai, LIAN Xin-yu, WANG Yong-gang, WANG Jiang, SUO Xin-kun

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Amorphous-like TiN Films as Barrier Layers for Copper by Shicheng Han, Shicheng Yang, Xiaohong Zeng, Ying Wu, Tong Liu, Hu Wang, Sunan Ding

Subjects: “…metallization…”
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Determination of metallization degree of pre-reduced chromite with image and rietveld analysis by Leino T., Taskinen P., Eric R.H.

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Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics by Yuri K. Nepochatov, Pyotr M. Pletnev, Vladimir F. Kosarev, Tatiana S. Gudyma

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Multilayer Metallization Systems of Submicron Integrated Circuits by V. V. Emelyanov

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Transmission Line Model Measurements of Metal-Semiconductor Contacts by M.M. Musztyfaga-Staszuk, P. Panek, A. Czupryński, C. Mele

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Effects of electroless nickel plating process on the microstructure and properties of complex shape ceramic capacitors by Yongtao Liu, Xinghua Zheng, Sizheng Hu, Dongqing Cai, Guanghui Li

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THE EFFECT OF SURFACTANTS ON SUPERCONFORMAL DEPOSITION OF ELECTROLESS COMPOSITES IN NANOSCALE PATTERNS by V. A. Bogush

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An analytical review on interfacial reactions in high-temperature die-attach: the insights into the effect of surface metallization and filler materials by Liu Canyu, Liu Changqing

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A novel two-step process for enhancing adhesion strength of cold-spray metallization of carbon fiber-reinforced plastics by Jiayu Sun, Kenta Yamanaka, Chrystelle Bernard, Yuchao Lei, Shaoyun Zhou, Hao Lin, Kazuhiro Ogawa, Akihiko Chiba

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Electrodeposition of Nickel onto Polymers: A Short Review of Plating Processes and Structural Properties by George W. Thompson, Mohammad J. Mahtabi

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A Three‐Terminal Memristive Artificial Neuron with Tunable Firing Probability by Mila Lewerenz, Elias Passerini, Luca Weber, Markus Fischer, Nadia Jimenez Olalla, Raphael Gisler, Alexandros Emboras, Mathieu Luisier, Miklos Csontos, Ueli Koch, Juerg Leuthold

Subjects: “…electrochemical metallization cell…”
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Academic V.A. Labunov - Happy Anniversary! by V. E. Borisenko, L. M. Lynkou

Subjects: “…copper metallization…”
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Exploring the selective enrichment of vanadium–titanium magnetite concentrate through metallization reduction roasting under the action of additives by Sun Kena, Jie Xiaowu, Zhang Yonglu, Yao Zhichao, Gao Wei, He Wenyi, Gao Guanjin

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Characterization of Rice Husk for Graphene Extraction and Metallization by Harrison Okechukwu Onovo, Ademola Abiona Agbeleye, Theddeus Tochukwu Akano, Olamilekan Razak Oloyede, Solomon Oaolapo Oyegbami, Emmanuel Oluwatimilehin Amoo

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Passivation of a Conductive System of Integrated Circuits with a Layer of Aluminum Nitride by V. V. Emelyanov

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