Showing 1 - 3 results of 3 for search '"FOWLP"', query time: 0.03s Refine Results
  1. 1
    Antenna-in-Package Using IC-Embedded Metal Fan-Out Wafer-Level Package for D-Band Applications

    Antenna-in-Package Using IC-Embedded Metal Fan-Out Wafer-Level Package for D-Band Applications by Ju-Yong Lee, Jein Yu, Wansik Kim, Jong-Min Yook

    Published 2025-01-01
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  2. 2
    Flexible, Fan-Out, Wafer-Level Packaging Using Polydimethylsiloxane and Printed Redistribution Layers

    Flexible, Fan-Out, Wafer-Level Packaging Using Polydimethylsiloxane and Printed Redistribution Layers by Muhammad Hassan Malik, Muhammad Khan, Sherjeel Khan, Ali Roshanghias

    Published 2024-04-01
    Subjects: “…FOWLP…”
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  3. 3
    Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging

    Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging by Ching-Feng Yu, Jr-Wei Peng, Chih-Cheng Hsiao, Chin-Hung Wang, Wei-Chung Lo

    Published 2025-03-01
    Subjects: “…fan-out wafer-level packaging (FOWLP)…”
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