Hybrid Bonding With Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography by Sungwoo Jeon, Sohwi Lee, Hyunsik Yoon

Subjects: Get full text

Recent Applications of Focused Ion Beam–Scanning Electron Microscopy in Advanced Packaging by Huan Zhang, Mengmeng Ma, Yuhang Liu, Wenwu Zhang, Chonglei Zhang

Subjects: Get full text

Microstructural analysis and design of electroplated-Cu micropillar under different process variables and pattern structures by Sangyeun Park, Byungkwon Chun, Sunbum Kim, Hak-Sung Kim, Hongyun So

Subjects: Get full text

Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect by Shih-Chi Yang, Yu-Tao Yang, Chih Chen

Subjects: Get full text

Advancing Sustainability in Fruit and Vegetable Packaging: The Role of Nanotechnology in Food Preservation by Farhang Hameed Awlqadr, Ammar B. Altemimi, Ali Muhi Aldeen Omar, Mohammed N. Saeed, Syamand Ahmed Qadir, Aryan Mahmood Faraj, Alaa Jabbar Abd Al‐Manhel, Tablo H. Salih, Mohammad Ali Hesarinejad, Italo Rennan Sousa Vieira

Subjects: “…advanced packaging techniques…”
Get full text

Achieving low-temperature Cu–Cu bonding platform via area-selective metal films with superior surface roughness for advanced packaging by Mu-Ping Hsu, Chi-Yu Chen, Hsin-Chi Chang, Kuan-Neng Chen

Subjects: Get full text

Low Phase Noise, Dual-Frequency Pierce MEMS Oscillators with Direct Print Additively Manufactured Amplifier Circuits by Liguan Li, Di Lan, Xu Han, Tinghung Liu, Julio Dewdney, Adnan Zaman, Ugur Guneroglu, Carlos Molina Martinez, Jing Wang

Subjects: Get full text

Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review by Guoliang Chen, Guiqi Wang, Zhenzhen Wang, Lijun Wang

Subjects: “…semiconductor conventional and advanced package…”
Get full text