Showing 1 - 3 results of 3 for search '"Advanced packaging"', query time: 0.02s Refine Results
  1. 1
    Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging

    Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging by Makoto Nagata, Takuji Miki

    Published 2024-01-01
    Subjects: “…Advanced packaging…”
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  2. 2
    The application of organic materials used in IC advanced packaging:A review

    The application of organic materials used in IC advanced packaging:A review by Liu Jikang

    Published 2025-04-01
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  3. 3
    High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions

    High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions by Shenggao Li, Mu-Shan Lin, Wei-Chih Chen, Chien-Chun Tsai

    Published 2024-01-01
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