First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer by Sang Woo Park, Seul Ki Hong, Sarah Eunkyung Kim, Jong Kyung Park

Subjects: “…3D integration…”
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Fine pitch superconducting interconnects obtained with Nb–Nb direct bonding by Candice Thomas, Pablo Renaud, Meriem Guergour, Edouard Deschaseaux, Christophe Dubarry, Jennifer Guillaume, Elisa Vermande, Alain Campo, Frank Fournel, Hadi Hijazi, Anne-Marie Papon, Catherine Pellissier, Jean Charbonnier

Subjects: “…3D integration…”
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Monolithic 3D Logic Gates Based on p‐Te and n‐Bi2S3 Complementary Thin‐Film Transistors by Yuqia Ran, Yiwen Song, Long Li, Xujin Song, Pingfan Gu, Qi Wang, Haifeng Du, Jinfeng Kang, Yu Ye

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Evolutions of interfacial microstructures in Cu/SiO2 hybrid joints during temperature cycling tests by Jia-Juen Ong, Dinh-Phuc Tran, Hua-Jing Huang, Wei-Lan Chiu, Shih-Chi Yang, Wen-Wei Wu, Hsiang-Hung Chiang, Chih Chen

Subjects: “…3D integration…”
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Enhanced thermal dissipation for BCB-bonded 3D integrated membrane photonic circuits by Salim Abdi, Kevin Williams, Yuqing Jiao

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Design of DC-60 GHz silicon based vertical interconnection structure by You Yuejuan, Liu Dexi, Liu Yawei, Shi Lei

Subjects: “…3d integration…”
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A retina-inspired pathway to real-time motion prediction inside image sensors for extreme-edge intelligence by Subhradip Chakraborty, Shay Snyder, Md Abdullah-Al Kaiser, Maryam Parsa, Gregory Schwartz, Akhilesh R Jaiswal

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Development of deep silicon plasma etching for 3D integration technology by А. А. Golishnikov, M. G. Putrya

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Miniaturized Ku-band transceiver based on 3D integration technology by Liu Haodong, Wu Hongjiang, Yu Xiaohui, Ma Zhangang

Subjects: “…3d integrated…”
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3D Crystal Construction by Single‐Crystal 2D Material Supercell Multiplying by Wenhao Li, Jichuang Shen, Yaqing Ma, Xiang Xu, Han Chen, Lida Yu, Chen Ji, Menglin He, Kezhao Ma, Yiwei Duo, Li Wang, Tongbo Wei, Liping Shi, Muhong Wu, Kaihui Liu, Huaze Zhu, Wei Kong

Subjects: “…2D/3D integration…”
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Energy-/Carbon-Aware Evaluation and Optimization of 3-D IC Architecture With Digital Compute-in-Memory Designs by Hyung Joon Byun, Udit Gupta, Jae-Sun Seo

Subjects: “…3-D integrated circuit (IC)…”
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A Chisel Generator for Standardized 3-D Die-to-Die Interconnects by Harrison Liew, Farhana Sheikh, Jong-Ru Guo, Zuoguo Wu, Borivoje Nikolic

Subjects: “…3-D integrated circuits…”
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Toward Fine-Grained Partitioning of Low-Level SRAM Caches for Emerging 3D-IC Designs by Sudipta Das, Bhawana Kumari, Siva Satyendra Sahoo, Yukai Chen, James Myers, Dragomir Milojevic, Dwaipayan Biswas, Julien Ryckaert

Subjects: “…3-D integrated circuit (3D-IC)…”
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