Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages
This study explores the impact of copper clip design on the thermal performance of driver MOSFET (Dr.MOS) packages with the goal of optimizing heat dissipation efficiency in microelectronic components. The study examines four key variables: clip thickness, material, attachment material, and plating...
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| Format: | Article |
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IEEE
2025-01-01
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| Series: | IEEE Access |
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| Online Access: | https://ieeexplore.ieee.org/document/10845060/ |
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| author | Hao-Lin Yen Fang-I Lai |
| author_facet | Hao-Lin Yen Fang-I Lai |
| author_sort | Hao-Lin Yen |
| collection | DOAJ |
| description | This study explores the impact of copper clip design on the thermal performance of driver MOSFET (Dr.MOS) packages with the goal of optimizing heat dissipation efficiency in microelectronic components. The study examines four key variables: clip thickness, material, attachment material, and plating material. The experimental results show that increasing the clip thickness from 0.15mm to 0.2mm leads to a 2.1% reduction in thermal resistance (from 3.3667°C/W to 3.2958°C/W). Furthermore, using copper C1100, which has higher thermal conductivity (391 W/m-K), further reduces thermal resistance, improving overall heat dissipation. Additionally, employing high-conductivity adhesives like SAC305 improves the thermal interface between the clip and wafer, while coatings such as graphene enhance thermal stability and corrosion resistance. Under high-voltage conditions (12V and 19V), the package with thicker copper clips and better attachment materials exhibited a significant reduction in surface temperature, dropping from 93.3°C to 71.7°C at 12V. These findings offer valuable insights for enhancing the thermal management efficiency of Dr.MOS packages, ensuring better reliability and longevity in high-power applications. |
| format | Article |
| id | doaj-art-ff7ccced44284e7489bac9c686c29398 |
| institution | Kabale University |
| issn | 2169-3536 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj-art-ff7ccced44284e7489bac9c686c293982025-01-25T00:01:30ZengIEEEIEEE Access2169-35362025-01-0113126761268110.1109/ACCESS.2025.353099710845060Effect of Clip Characteristics on Thermal Performance of Dr.MOS PackagesHao-Lin Yen0https://orcid.org/0009-0007-2041-1607Fang-I Lai1Department of Electrical Engineering Program C, Yuan Ze University, Taoyuan, TaiwanDepartment of Electrical Engineering Program C, Yuan Ze University, Taoyuan, TaiwanThis study explores the impact of copper clip design on the thermal performance of driver MOSFET (Dr.MOS) packages with the goal of optimizing heat dissipation efficiency in microelectronic components. The study examines four key variables: clip thickness, material, attachment material, and plating material. The experimental results show that increasing the clip thickness from 0.15mm to 0.2mm leads to a 2.1% reduction in thermal resistance (from 3.3667°C/W to 3.2958°C/W). Furthermore, using copper C1100, which has higher thermal conductivity (391 W/m-K), further reduces thermal resistance, improving overall heat dissipation. Additionally, employing high-conductivity adhesives like SAC305 improves the thermal interface between the clip and wafer, while coatings such as graphene enhance thermal stability and corrosion resistance. Under high-voltage conditions (12V and 19V), the package with thicker copper clips and better attachment materials exhibited a significant reduction in surface temperature, dropping from 93.3°C to 71.7°C at 12V. These findings offer valuable insights for enhancing the thermal management efficiency of Dr.MOS packages, ensuring better reliability and longevity in high-power applications.https://ieeexplore.ieee.org/document/10845060/Dr.MOS package thermal performanceclip thicknessclip materialattachment materialcoating |
| spellingShingle | Hao-Lin Yen Fang-I Lai Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages IEEE Access Dr.MOS package thermal performance clip thickness clip material attachment material coating |
| title | Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages |
| title_full | Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages |
| title_fullStr | Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages |
| title_full_unstemmed | Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages |
| title_short | Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages |
| title_sort | effect of clip characteristics on thermal performance of dr mos packages |
| topic | Dr.MOS package thermal performance clip thickness clip material attachment material coating |
| url | https://ieeexplore.ieee.org/document/10845060/ |
| work_keys_str_mv | AT haolinyen effectofclipcharacteristicsonthermalperformanceofdrmospackages AT fangilai effectofclipcharacteristicsonthermalperformanceofdrmospackages |