Evaluation of Dimensional Characteristics of Conductive Pattern Elements of 3D-Printed Circuit Boards
Introduction. A review of foreign publications on 3D printing methods shows the possibility of their application for the manufacture of printed circuit boards (PCBs), while demonstrating the growth of interest in this field. One of the available methods is fused deposition modeling, which can be use...
Saved in:
| Main Authors: | O. N. Smirnova, A. A. Aleksandrov, Yu. S. Bobrova, K. M. Moiseev |
|---|---|
| Format: | Article |
| Language: | Russian |
| Published: |
Saint Petersburg Electrotechnical University "LETI"
2023-10-01
|
| Series: | Известия высших учебных заведений России: Радиоэлектроника |
| Subjects: | |
| Online Access: | https://re.eltech.ru/jour/article/view/779 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Alignment Error Estimation of the Conductive Pattern of 3D-Printed Circuit Boards
by: O. N. Smirnova, et al.
Published: (2024-07-01) -
Strategic Roadmap for 3D‐Printed Reinforcement Using Fused Deposition Modeling: A State‐of‐the Art Review
by: Mohammad Hematibahar, et al.
Published: (2025-06-01) -
Application of the mineral processing methods in recycling the waste printed circuit boards
by: Magdalinović Srđana, et al.
Published: (2024-01-01) -
Review on 3D Printing Filaments Used in Fused Deposition Modeling Method for Dermatological Preparations
by: Yong Li Chan, et al.
Published: (2025-05-01) -
Pelarutan Selektif Tembaga dari Limbah Printed Circuit Board dengan Hidrogen Peroksida
by: Gatut Ari Wardani, et al.
Published: (2018-02-01)