APA (7th ed.) Citation

Zhang, X. M., Xiao, X., Wu, X., & Liu, J. G. Preparation and properties of heat-sealable polyimide films with comparable coefficient of thermal expansion and good adhesion to copper matrix. Budapest University of Technology and Economics.

Chicago Style (17th ed.) Citation

Zhang, X. M., X. Xiao, X. Wu, and J. G. Liu. Preparation and Properties of Heat-sealable Polyimide Films with Comparable Coefficient of Thermal Expansion and Good Adhesion to Copper Matrix. Budapest University of Technology and Economics.

MLA (9th ed.) Citation

Zhang, X. M., et al. Preparation and Properties of Heat-sealable Polyimide Films with Comparable Coefficient of Thermal Expansion and Good Adhesion to Copper Matrix. Budapest University of Technology and Economics.