Behaviors of Oxide Film during Semisolid Brazing of SiCp/6063Al Composite Materials
The semisolid brazing of SiCp/6063Al under an applied pressure using Zn-Al-Cu filler metal was investigated. The samples to be joined were heated from 380°C to 382°C, 386°C, 392°C, and 410°C under a constant pressure of 10 MPa, respectively. Effects of the temperature on microstructural evolution an...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2018-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2018/3246371 |
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