Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics
The basic element of the design of a power module is a metallized ceramic substrate. In this work, the formation of metallization coatings by the method of thermal transfer of metallization pastes (Mo-Mn-Si + binder) for alumina and aluminum nitride ceramics was carried out. The fixing of the metall...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Uralʹskij federalʹnyj universitet imeni pervogo Prezidenta Rossii B.N. Elʹcina
2022-07-01
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| Series: | Chimica Techno Acta |
| Subjects: | |
| Online Access: | https://chimicatechnoacta.ru/article/view/5990 |
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| Summary: | The basic element of the design of a power module is a metallized ceramic substrate. In this work, the formation of metallization coatings by the method of thermal transfer of metallization pastes (Mo-Mn-Si + binder) for alumina and aluminum nitride ceramics was carried out. The fixing of the metallization coating on the ceramic substrate was performed by firing at a temperature of 1320 °C. The subsequent deposition of the copper layer was carried out by the method of cold gas-dynamic spraying (CGDS) followed by annealing of the deposited coating. For high-quality adhesion, the optimum annealing temperature was 1000 °C. |
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| ISSN: | 2411-1414 |