A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes

A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes

This study proposes a novel iron wire activation method for electroless Ni-P plating on 6H-SiC substrates, offering a sustainable alternative to traditional metal activation techniques, focusing on the surface roughness effect on the microhardness and Ni-P plating efficiency of 6H-SiC substrates. Th...

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Bibliographic Details
Main Authors: Hossein Ahmadian, Tianfeng Zhou, Weijia Guo, Qian Yu, A.M. Sadoun, A. Fathy, A. Wagih
Format: Article
Language:English
Published: Elsevier 2024-12-01
Series:Results in Engineering
Subjects:
Electroless Ni-P plating
SiC substrates
Wire activation technique
Surface roughness
Microhardness
Adhesion strength
Online Access:http://www.sciencedirect.com/science/article/pii/S2590123024013811
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