Machining Path Optimization of Inductively Coupled Plasma Based on Surface Heat Transfer Model

Inductively coupled plasma (ICP), a non-contact optical processing method, has been widely used in the preparation of fused quartz. However, the thermal effect during processing inevitably affects the stability of the removal rate, reduces the processing accuracy, and restricts the further developme...

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Main Authors: Peiqi Jiao, Bin Fan, Qiang Xin, Xiang Wu, Hong Wang
Format: Article
Language:English
Published: MDPI AG 2025-01-01
Series:Micromachines
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Online Access:https://www.mdpi.com/2072-666X/16/1/71
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author Peiqi Jiao
Bin Fan
Qiang Xin
Xiang Wu
Hong Wang
author_facet Peiqi Jiao
Bin Fan
Qiang Xin
Xiang Wu
Hong Wang
author_sort Peiqi Jiao
collection DOAJ
description Inductively coupled plasma (ICP), a non-contact optical processing method, has been widely used in the preparation of fused quartz. However, the thermal effect during processing inevitably affects the stability of the removal rate, reduces the processing accuracy, and restricts the further development of plasma processing. This paper analyzes the critical temperature that affects the changes in plasma removal depth, establishes a heat transfer model for plasma jet processing through simulations, derives the heat conduction equation during processing, and obtains the critical radius corresponding to the critical temperature related to the processing speed. Additionally, this work analyzes the path temperature of the grating track used in processing and obtains the path temperature variation curve. Based on the critical radius, a staggered grating track was proposed, which verified that this track can effectively control the path temperature, thereby suppressing the error caused by the thermal effect of processing. This study not only helps to gain a deeper understanding of the heat transfer process in plasma machining, but also provides a basis for achieving high-precision plasma machining path optimization schemes.
format Article
id doaj-art-f5db366ff6964dcd9dc75cf3adc78b1f
institution Kabale University
issn 2072-666X
language English
publishDate 2025-01-01
publisher MDPI AG
record_format Article
series Micromachines
spelling doaj-art-f5db366ff6964dcd9dc75cf3adc78b1f2025-01-24T13:42:02ZengMDPI AGMicromachines2072-666X2025-01-011617110.3390/mi16010071Machining Path Optimization of Inductively Coupled Plasma Based on Surface Heat Transfer ModelPeiqi Jiao0Bin Fan1Qiang Xin2Xiang Wu3Hong Wang4National Key Laboratory of Optical Field Manipulation Science and Technology, Chinese Academy of Sciences, Chengdu 610209, ChinaInstitute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, ChinaInstitute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, ChinaNational Key Laboratory of Optical Field Manipulation Science and Technology, Chinese Academy of Sciences, Chengdu 610209, ChinaNational Key Laboratory of Optical Field Manipulation Science and Technology, Chinese Academy of Sciences, Chengdu 610209, ChinaInductively coupled plasma (ICP), a non-contact optical processing method, has been widely used in the preparation of fused quartz. However, the thermal effect during processing inevitably affects the stability of the removal rate, reduces the processing accuracy, and restricts the further development of plasma processing. This paper analyzes the critical temperature that affects the changes in plasma removal depth, establishes a heat transfer model for plasma jet processing through simulations, derives the heat conduction equation during processing, and obtains the critical radius corresponding to the critical temperature related to the processing speed. Additionally, this work analyzes the path temperature of the grating track used in processing and obtains the path temperature variation curve. Based on the critical radius, a staggered grating track was proposed, which verified that this track can effectively control the path temperature, thereby suppressing the error caused by the thermal effect of processing. This study not only helps to gain a deeper understanding of the heat transfer process in plasma machining, but also provides a basis for achieving high-precision plasma machining path optimization schemes.https://www.mdpi.com/2072-666X/16/1/71optical processingheat transfer modelspath optimization
spellingShingle Peiqi Jiao
Bin Fan
Qiang Xin
Xiang Wu
Hong Wang
Machining Path Optimization of Inductively Coupled Plasma Based on Surface Heat Transfer Model
Micromachines
optical processing
heat transfer models
path optimization
title Machining Path Optimization of Inductively Coupled Plasma Based on Surface Heat Transfer Model
title_full Machining Path Optimization of Inductively Coupled Plasma Based on Surface Heat Transfer Model
title_fullStr Machining Path Optimization of Inductively Coupled Plasma Based on Surface Heat Transfer Model
title_full_unstemmed Machining Path Optimization of Inductively Coupled Plasma Based on Surface Heat Transfer Model
title_short Machining Path Optimization of Inductively Coupled Plasma Based on Surface Heat Transfer Model
title_sort machining path optimization of inductively coupled plasma based on surface heat transfer model
topic optical processing
heat transfer models
path optimization
url https://www.mdpi.com/2072-666X/16/1/71
work_keys_str_mv AT peiqijiao machiningpathoptimizationofinductivelycoupledplasmabasedonsurfaceheattransfermodel
AT binfan machiningpathoptimizationofinductivelycoupledplasmabasedonsurfaceheattransfermodel
AT qiangxin machiningpathoptimizationofinductivelycoupledplasmabasedonsurfaceheattransfermodel
AT xiangwu machiningpathoptimizationofinductivelycoupledplasmabasedonsurfaceheattransfermodel
AT hongwang machiningpathoptimizationofinductivelycoupledplasmabasedonsurfaceheattransfermodel