A synchronous improvement of strength and elongation caused by solid solution in low-silver SAC solder with superior necking resistance properties
The current SAC(Sn–Ag–Cu) solder often experiences rapid degradation of mechanical properties at high temperatures and is prone to fracture under dynamic loads, thus failing to meet the interconnection requirements of industrial electronic products that operate under high power and vibration loads....
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424024785 |
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