Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry

Detection of the crack in an object is a critical problem for the health monitoring of a transparent object. The real-time and quantitative measurement of the crack-tip stress intensity factor (SIF) remains an open issue. In this paper, an approach for real-time and quantitative measurement for the...

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Main Authors: Haiting Xia, Rongxin Guo, Feng Yan, Heming Cheng
Format: Article
Language:English
Published: Wiley 2018-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2018/1954573
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author Haiting Xia
Rongxin Guo
Feng Yan
Heming Cheng
author_facet Haiting Xia
Rongxin Guo
Feng Yan
Heming Cheng
author_sort Haiting Xia
collection DOAJ
description Detection of the crack in an object is a critical problem for the health monitoring of a transparent object. The real-time and quantitative measurement of the crack-tip stress intensity factor (SIF) remains an open issue. In this paper, an approach for real-time and quantitative measurement for the SIFs of a Mode I crack is presented based on digital holographic interferometry (DHI). A transmission digital holographic system is established to measure the phase difference of an object wave during loading. The expression to achieve the SIF from the phase difference is formulated. To enhance the accuracy of measurement, calibrated phase unwrapping based on least-squares and iteration and median filtering is applied to retrieve the actual phase from the noisy wrapped one. The SIFs of the Mode I crack in a transparent polymethyl methacrylate (PMMA) specimen are measured by this approach. The results are compared with the theoretical ones to demonstrate the feasibility of the proposed approach.
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institution Kabale University
issn 1687-8434
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language English
publishDate 2018-01-01
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spelling doaj-art-f55e5f0554fb4c0b99b6d3c13686c5c22025-02-03T05:50:27ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422018-01-01201810.1155/2018/19545731954573Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic InterferometryHaiting Xia0Rongxin Guo1Feng Yan2Heming Cheng3Faculty of Civil Engineering and Mechanics, Kunming University of Science and Technology, Kunming, Yunnan 650500, ChinaFaculty of Civil Engineering and Mechanics, Kunming University of Science and Technology, Kunming, Yunnan 650500, ChinaFaculty of Civil Engineering and Mechanics, Kunming University of Science and Technology, Kunming, Yunnan 650500, ChinaFaculty of Civil Engineering and Mechanics, Kunming University of Science and Technology, Kunming, Yunnan 650500, ChinaDetection of the crack in an object is a critical problem for the health monitoring of a transparent object. The real-time and quantitative measurement of the crack-tip stress intensity factor (SIF) remains an open issue. In this paper, an approach for real-time and quantitative measurement for the SIFs of a Mode I crack is presented based on digital holographic interferometry (DHI). A transmission digital holographic system is established to measure the phase difference of an object wave during loading. The expression to achieve the SIF from the phase difference is formulated. To enhance the accuracy of measurement, calibrated phase unwrapping based on least-squares and iteration and median filtering is applied to retrieve the actual phase from the noisy wrapped one. The SIFs of the Mode I crack in a transparent polymethyl methacrylate (PMMA) specimen are measured by this approach. The results are compared with the theoretical ones to demonstrate the feasibility of the proposed approach.http://dx.doi.org/10.1155/2018/1954573
spellingShingle Haiting Xia
Rongxin Guo
Feng Yan
Heming Cheng
Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry
Advances in Materials Science and Engineering
title Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry
title_full Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry
title_fullStr Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry
title_full_unstemmed Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry
title_short Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry
title_sort real time and quantitative measurement of crack tip stress intensity factors using digital holographic interferometry
url http://dx.doi.org/10.1155/2018/1954573
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