Empirical Modeling and Performance Evaluation of Monolithic-3D Dynamic Random-Access Memory
Among the various three-dimensional (3D) stacking techniques essential for scaling electronic devices, monolithic-3D (M3D) integration technology offers the highest integration density. However, this technology faces challenges such as sensitivity to high temperatures and electrical interference owi...
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| Main Authors: | , , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10904244/ |
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