Comparative Analysis of the Corrosion Behavior of Plain and Nanoporous Copper
This research investigates the corrosion behavior of copper (Cu) through a comprehensive analysis of both plain and nanoporous Cu thin films. A combination of weight-loss methods for quantitative analysis, along with polarization testing and scanning electron microscopy, is employed for both quantit...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-01-01
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| Series: | Electrochem |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-3293/6/1/1 |
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| Summary: | This research investigates the corrosion behavior of copper (Cu) through a comprehensive analysis of both plain and nanoporous Cu thin films. A combination of weight-loss methods for quantitative analysis, along with polarization testing and scanning electron microscopy, is employed for both quantitative and qualitative assessments of Cu corrosion dynamics. The corrosion mechanisms in chloride and nitrate solutions are compared, with an additional discussion on the influence of atmospheric oxygen (O<sub>2</sub>). The results demonstrate that chloride ions and the presence of O<sub>2</sub> create the most severe corrosion conditions, while the concentration of salts has a relatively minor effect on the corrosion behavior. Notably, the comparative study reveals that nanoporous Cu exhibits a greater corrosion tendency, as indicated by more negative corrosion potentials. However, its corrosion rates are lower than those of plain Cu, as determined by corrosion current density measurements. |
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| ISSN: | 2673-3293 |