Refinement of eutectic structure and precipitates of Cu–20Ag alloy due to Y microalloying
Copper-silver alloy rod with high mechanical properties and stable conductivity are the key materials for the preparation of microfilaments used in endoscopy and other medical fields. In this paper, the microstructure of Cu–20Ag rod was regulated by adding trace rare earth Y in order to improve the...
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Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424024505 |
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| author | Zhichao Wang Chaomin Zhang Shaolin Li Kexing Song Yanjun Zhou Yahui Liu Junjie Sun Jun Cao |
| author_facet | Zhichao Wang Chaomin Zhang Shaolin Li Kexing Song Yanjun Zhou Yahui Liu Junjie Sun Jun Cao |
| author_sort | Zhichao Wang |
| collection | DOAJ |
| description | Copper-silver alloy rod with high mechanical properties and stable conductivity are the key materials for the preparation of microfilaments used in endoscopy and other medical fields. In this paper, the microstructure of Cu–20Ag rod was regulated by adding trace rare earth Y in order to improve the comprehensive performance of copper-silver alloy further. and studies the distribution and existence of rare earth Y as well as the influence on the performance of copper-silver alloy rod billet. The results of research show that: rare earth Y mainly exists in the branching nodes of the eutectic organization, so that the alloy in the solidification of constitutional supercooling increases, thus refining the eutectic structure, and make it uniformly distributed. After addition of 0.01 wt%Y, Cu4Y was precipitated in the eutectic structure of the rod. After adding 0.03 wt%Y, the precipitates types increased to trace intermetallic compound AgY and nanoparticles Cu4Y. The increase of the interface between eutectic structure and Cu matrix decreases the electron scattering probability. This is the main factor to lead to the decrease of electrical conductivity. The precipitation hardening of precipitated phase and the increase of interface between eutectic structure and Cu matrix are the main factors for the increase of tensile strength of bar billet. The main factor of the decrease in the conductivity of rod billet is the increase of Ag phase dissolved in eutectic structure and the interface between eutectic structure and Cu matrix. |
| format | Article |
| id | doaj-art-f0940a76dae747c7bebb6bf522969cd8 |
| institution | OA Journals |
| issn | 2238-7854 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | Elsevier |
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| series | Journal of Materials Research and Technology |
| spelling | doaj-art-f0940a76dae747c7bebb6bf522969cd82025-08-20T02:35:26ZengElsevierJournal of Materials Research and Technology2238-78542024-11-01335518552710.1016/j.jmrt.2024.10.179Refinement of eutectic structure and precipitates of Cu–20Ag alloy due to Y microalloyingZhichao Wang0Chaomin Zhang1Shaolin Li2Kexing Song3Yanjun Zhou4Yahui Liu5Junjie Sun6Jun Cao7Henan University of Science and Technology, Henan Key Laboratory of Nonferrous Materials Science and Processing Technology, Luoyang, 471023. China; Provincial and Ministerial Co-construction Colaborative Innovation Center of Nonferrous New Materials and Advanced Procesing Technology, Luoyang, 471023, ChinaHenan University of Science and Technology, Henan Key Laboratory of Nonferrous Materials Science and Processing Technology, Luoyang, 471023. China; Provincial and Ministerial Co-construction Colaborative Innovation Center of Nonferrous New Materials and Advanced Procesing Technology, Luoyang, 471023, China; Corresponding author. Henan University of Science and Technology, Henan Key Laboratory of Nonferrous Materials Science and Processing Technology, Luoyang, 471023, China.Henan University of Science and Technology, Henan Key Laboratory of Nonferrous Materials Science and Processing Technology, Luoyang, 471023. China; Provincial and Ministerial Co-construction Colaborative Innovation Center of Nonferrous New Materials and Advanced Procesing Technology, Luoyang, 471023, China; Corresponding author. Henan University of Science and Technology, Henan Key Laboratory of Nonferrous Materials Science and Processing Technology, Luoyang, 471023, China.Henan University of Science and Technology, Henan Key Laboratory of Nonferrous Materials Science and Processing Technology, Luoyang, 471023. China; Institute of Materials, Henan Academy of Sciences, Zhengzhou, 450046, ChinaHenan University of Science and Technology, Henan Key Laboratory of Nonferrous Materials Science and Processing Technology, Luoyang, 471023. China; Provincial and Ministerial Co-construction Colaborative Innovation Center of Nonferrous New Materials and Advanced Procesing Technology, Luoyang, 471023, ChinaHenan University of Science and Technology, Henan Key Laboratory of Nonferrous Materials Science and Processing Technology, Luoyang, 471023. China; Provincial and Ministerial Co-construction Colaborative Innovation Center of Nonferrous New Materials and Advanced Procesing Technology, Luoyang, 471023, ChinaState Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an, 710049, ChinaSchool of Mechanical Engineering, Henan Polytechnic University, Jiaozuo 454000, ChinaCopper-silver alloy rod with high mechanical properties and stable conductivity are the key materials for the preparation of microfilaments used in endoscopy and other medical fields. In this paper, the microstructure of Cu–20Ag rod was regulated by adding trace rare earth Y in order to improve the comprehensive performance of copper-silver alloy further. and studies the distribution and existence of rare earth Y as well as the influence on the performance of copper-silver alloy rod billet. The results of research show that: rare earth Y mainly exists in the branching nodes of the eutectic organization, so that the alloy in the solidification of constitutional supercooling increases, thus refining the eutectic structure, and make it uniformly distributed. After addition of 0.01 wt%Y, Cu4Y was precipitated in the eutectic structure of the rod. After adding 0.03 wt%Y, the precipitates types increased to trace intermetallic compound AgY and nanoparticles Cu4Y. The increase of the interface between eutectic structure and Cu matrix decreases the electron scattering probability. This is the main factor to lead to the decrease of electrical conductivity. The precipitation hardening of precipitated phase and the increase of interface between eutectic structure and Cu matrix are the main factors for the increase of tensile strength of bar billet. The main factor of the decrease in the conductivity of rod billet is the increase of Ag phase dissolved in eutectic structure and the interface between eutectic structure and Cu matrix.http://www.sciencedirect.com/science/article/pii/S2238785424024505Cu-20Ag alloyRare earth YConstitutional supercoolingEutectic structurePrecipitates |
| spellingShingle | Zhichao Wang Chaomin Zhang Shaolin Li Kexing Song Yanjun Zhou Yahui Liu Junjie Sun Jun Cao Refinement of eutectic structure and precipitates of Cu–20Ag alloy due to Y microalloying Journal of Materials Research and Technology Cu-20Ag alloy Rare earth Y Constitutional supercooling Eutectic structure Precipitates |
| title | Refinement of eutectic structure and precipitates of Cu–20Ag alloy due to Y microalloying |
| title_full | Refinement of eutectic structure and precipitates of Cu–20Ag alloy due to Y microalloying |
| title_fullStr | Refinement of eutectic structure and precipitates of Cu–20Ag alloy due to Y microalloying |
| title_full_unstemmed | Refinement of eutectic structure and precipitates of Cu–20Ag alloy due to Y microalloying |
| title_short | Refinement of eutectic structure and precipitates of Cu–20Ag alloy due to Y microalloying |
| title_sort | refinement of eutectic structure and precipitates of cu 20ag alloy due to y microalloying |
| topic | Cu-20Ag alloy Rare earth Y Constitutional supercooling Eutectic structure Precipitates |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424024505 |
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