Review on the impact of marine environment on the reliability of electronic packaging materials
Marine environments pose significant challenges to the reliability of electronic packaging materials. This review summarizes the main degradation mechanisms and reliability impacts of electronic packaging materials under marine conditions, including salt spray corrosion, high humidity, thermal cycli...
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| Format: | Article |
| Language: | English |
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Frontiers Media S.A.
2025-04-01
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| Series: | Frontiers in Materials |
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| Online Access: | https://www.frontiersin.org/articles/10.3389/fmats.2025.1584349/full |
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| author | Fengyong Lang Zhenrui Zhou Jia Liu Meng Cui Zhongqing Zhang |
| author_facet | Fengyong Lang Zhenrui Zhou Jia Liu Meng Cui Zhongqing Zhang |
| author_sort | Fengyong Lang |
| collection | DOAJ |
| description | Marine environments pose significant challenges to the reliability of electronic packaging materials. This review summarizes the main degradation mechanisms and reliability impacts of electronic packaging materials under marine conditions, including salt spray corrosion, high humidity, thermal cycling, and mechanical shock. Salt spray corrosion initiates localized galvanic corrosion through chloride ion (Cl−) diffusion, creating corrosion pits and stress concentration, thereby accelerating electrochemical-mechanical coupled failures. High humidity promotes moisture ingress into polymer packaging materials, resulting in hygroscopic plasticization, weakened interfacial adhesion, and delamination failure. Thermal cycling, due to mismatched coefficients of thermal expansion (CTE), induces growth of interfacial intermetallic compound (IMC) layers at solder joints and creep-fatigue interactions, further promoting interfacial crack propagation. Mechanical shock generates transient, high-strain-rate loading, rapidly initiating and propagating cracks within brittle packaging structures, ultimately leading to structural failure. Additionally, this paper discusses the current status and limitations of Physics of Failure (PoF)-based reliability models such as the Coffin-Manson and Arrhenius models for evaluating electronic packaging reliability in marine environments. Finally, it suggests that future studies should further develop multiphysics coupling models to more accurately predict long-term material performance under extreme marine conditions. |
| format | Article |
| id | doaj-art-efbeb79e95014bd7aa60a5b289f32e18 |
| institution | OA Journals |
| issn | 2296-8016 |
| language | English |
| publishDate | 2025-04-01 |
| publisher | Frontiers Media S.A. |
| record_format | Article |
| series | Frontiers in Materials |
| spelling | doaj-art-efbeb79e95014bd7aa60a5b289f32e182025-08-20T02:12:19ZengFrontiers Media S.A.Frontiers in Materials2296-80162025-04-011210.3389/fmats.2025.15843491584349Review on the impact of marine environment on the reliability of electronic packaging materialsFengyong Lang0Zhenrui Zhou1Jia Liu2Meng Cui3Zhongqing Zhang4China State Shipbuilding Corporation (CSSC) Systems Engineering Research Institute, Beijing, ChinaSchool of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an, ChinaChina State Shipbuilding Corporation (CSSC) Systems Engineering Research Institute, Beijing, ChinaChina State Shipbuilding Corporation (CSSC) Systems Engineering Research Institute, Beijing, ChinaQianYuan National Laboratory, Hangzhou, ChinaMarine environments pose significant challenges to the reliability of electronic packaging materials. This review summarizes the main degradation mechanisms and reliability impacts of electronic packaging materials under marine conditions, including salt spray corrosion, high humidity, thermal cycling, and mechanical shock. Salt spray corrosion initiates localized galvanic corrosion through chloride ion (Cl−) diffusion, creating corrosion pits and stress concentration, thereby accelerating electrochemical-mechanical coupled failures. High humidity promotes moisture ingress into polymer packaging materials, resulting in hygroscopic plasticization, weakened interfacial adhesion, and delamination failure. Thermal cycling, due to mismatched coefficients of thermal expansion (CTE), induces growth of interfacial intermetallic compound (IMC) layers at solder joints and creep-fatigue interactions, further promoting interfacial crack propagation. Mechanical shock generates transient, high-strain-rate loading, rapidly initiating and propagating cracks within brittle packaging structures, ultimately leading to structural failure. Additionally, this paper discusses the current status and limitations of Physics of Failure (PoF)-based reliability models such as the Coffin-Manson and Arrhenius models for evaluating electronic packaging reliability in marine environments. Finally, it suggests that future studies should further develop multiphysics coupling models to more accurately predict long-term material performance under extreme marine conditions.https://www.frontiersin.org/articles/10.3389/fmats.2025.1584349/fullmarine environmentelectronic packaging materialssalt spray corrosionmoisture-induced plasticizationtemperature cyclingmechanical shock |
| spellingShingle | Fengyong Lang Zhenrui Zhou Jia Liu Meng Cui Zhongqing Zhang Review on the impact of marine environment on the reliability of electronic packaging materials Frontiers in Materials marine environment electronic packaging materials salt spray corrosion moisture-induced plasticization temperature cycling mechanical shock |
| title | Review on the impact of marine environment on the reliability of electronic packaging materials |
| title_full | Review on the impact of marine environment on the reliability of electronic packaging materials |
| title_fullStr | Review on the impact of marine environment on the reliability of electronic packaging materials |
| title_full_unstemmed | Review on the impact of marine environment on the reliability of electronic packaging materials |
| title_short | Review on the impact of marine environment on the reliability of electronic packaging materials |
| title_sort | review on the impact of marine environment on the reliability of electronic packaging materials |
| topic | marine environment electronic packaging materials salt spray corrosion moisture-induced plasticization temperature cycling mechanical shock |
| url | https://www.frontiersin.org/articles/10.3389/fmats.2025.1584349/full |
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