APA (7th ed.) Citation

Irfan, H. M., Lee, C., Mazumdar, D., Aryanfar, Y., & Wu, W. Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling. MDPI AG.

Chicago Style (17th ed.) Citation

Irfan, Hafiz M., Cheng-Yu Lee, Debayan Mazumdar, Yashar Aryanfar, and Wei Wu. Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling. MDPI AG.

MLA (9th ed.) Citation

Irfan, Hafiz M., et al. Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling. MDPI AG.