A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging
Copper pillar bumps are widely utilized in advanced packaging technologies, representing a crucial foundation for 3D packaging. However, the mechanical properties of Sn3Ag bumps on copper columns often fall short of meeting increasingly demanding service conditions. Additionally, the loss of effecti...
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| Format: | Article |
| Language: | English |
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Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424025912 |
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| author | JinTao Wang YiNi Chen ZiWen Lv XiaoYu Han ZiHan Pan Feng Tian MingYuan Zhao HongBo Xu GaoLiang Peng HongTao Chen MingYu Li |
| author_facet | JinTao Wang YiNi Chen ZiWen Lv XiaoYu Han ZiHan Pan Feng Tian MingYuan Zhao HongBo Xu GaoLiang Peng HongTao Chen MingYu Li |
| author_sort | JinTao Wang |
| collection | DOAJ |
| description | Copper pillar bumps are widely utilized in advanced packaging technologies, representing a crucial foundation for 3D packaging. However, the mechanical properties of Sn3Ag bumps on copper columns often fall short of meeting increasingly demanding service conditions. Additionally, the loss of effectiveness due to excessive growth of intermetallic compounds at the interface needs to be addressed. To enhance the Sn₃Ag bumps and inhibit the excessive growth of intermetallic compounds, CoSn₃ nanocrystals were prepared, and Sn₃Ag–CoSn₃ composite copper pillar bumps were fabricated through composite electroplating. Upon reflowing, the CoSn3 nanocrystals decomposed, resulting in a significant formation of (Cu,Co)6Sn5 nanoparticles within the Sn3Ag matrix. The (Cu,Co)6Sn5 nanoparticles not only strengthen the solder joints by pinning, but also significantly reduced the excessive growth of interfacial intermetallic compounds, ultimately improving the service performance and reliability of the solder joints. |
| format | Article |
| id | doaj-art-eebf943c72cc410a8a180c46256ebbfe |
| institution | OA Journals |
| issn | 2238-7854 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-eebf943c72cc410a8a180c46256ebbfe2025-08-20T01:57:24ZengElsevierJournal of Materials Research and Technology2238-78542024-11-01337157716810.1016/j.jmrt.2024.11.063A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packagingJinTao Wang0YiNi Chen1ZiWen Lv2XiaoYu Han3ZiHan Pan4Feng Tian5MingYuan Zhao6HongBo Xu7GaoLiang Peng8HongTao Chen9MingYu Li10QianYuan National Laboratory, HangZhou, 310000, China; Corresponding author.Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, ChinaState Key Laboratory of Robotics and System, Harbin Institute of Technology, Harbin, 150001, ChinaChongqing Materials Research Institute Co.Ltd, Chongqing, 400001, ChinaState Key Laboratory of Robotics and System, Harbin Institute of Technology, Harbin, 150001, ChinaSauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, ChinaQianYuan National Laboratory, HangZhou, 310000, ChinaQianYuan National Laboratory, HangZhou, 310000, ChinaState Key Laboratory of Robotics and System, Harbin Institute of Technology, Harbin, 150001, China; Corresponding author.Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; Corresponding author.Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, ChinaCopper pillar bumps are widely utilized in advanced packaging technologies, representing a crucial foundation for 3D packaging. However, the mechanical properties of Sn3Ag bumps on copper columns often fall short of meeting increasingly demanding service conditions. Additionally, the loss of effectiveness due to excessive growth of intermetallic compounds at the interface needs to be addressed. To enhance the Sn₃Ag bumps and inhibit the excessive growth of intermetallic compounds, CoSn₃ nanocrystals were prepared, and Sn₃Ag–CoSn₃ composite copper pillar bumps were fabricated through composite electroplating. Upon reflowing, the CoSn3 nanocrystals decomposed, resulting in a significant formation of (Cu,Co)6Sn5 nanoparticles within the Sn3Ag matrix. The (Cu,Co)6Sn5 nanoparticles not only strengthen the solder joints by pinning, but also significantly reduced the excessive growth of interfacial intermetallic compounds, ultimately improving the service performance and reliability of the solder joints.http://www.sciencedirect.com/science/article/pii/S22387854240259123D packagingCopper pillarNanoparticlesCoatingElectroplated |
| spellingShingle | JinTao Wang YiNi Chen ZiWen Lv XiaoYu Han ZiHan Pan Feng Tian MingYuan Zhao HongBo Xu GaoLiang Peng HongTao Chen MingYu Li A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging Journal of Materials Research and Technology 3D packaging Copper pillar Nanoparticles Coating Electroplated |
| title | A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging |
| title_full | A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging |
| title_fullStr | A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging |
| title_full_unstemmed | A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging |
| title_short | A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging |
| title_sort | sn3ag cosn3 composite copper pillar bump for three dimensional packaging |
| topic | 3D packaging Copper pillar Nanoparticles Coating Electroplated |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424025912 |
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