Wang, J., Chen, Y., Lv, Z., Han, X., Pan, Z., Tian, F., . . . Li, M. A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging. Elsevier.
Chicago Style (17th ed.) CitationWang, JinTao, et al. A Sn3Ag–CoSn3 Composite Copper Pillar Bump for Three-dimensional Packaging. Elsevier.
MLA (9th ed.) CitationWang, JinTao, et al. A Sn3Ag–CoSn3 Composite Copper Pillar Bump for Three-dimensional Packaging. Elsevier.
Warning: These citations may not always be 100% accurate.