Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method
Graphene and its derivatives have excellent thermal conductivity, and are common additives for metal-based nanocomposites. However, the easy aggregation of graphene and metal nanoparticles severely limits uniform mixing, and hinders development and performance improvement of metal/graphene composite...
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| Format: | Article |
| Language: | English |
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Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424026917 |
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| author | Hegeng Wei Zexi Zhang Zebo Li Linfeng Peng Guannan Yang Tianshuo Zhao Yu Zhang Guanghan Huang Chengqiang Cui |
| author_facet | Hegeng Wei Zexi Zhang Zebo Li Linfeng Peng Guannan Yang Tianshuo Zhao Yu Zhang Guanghan Huang Chengqiang Cui |
| author_sort | Hegeng Wei |
| collection | DOAJ |
| description | Graphene and its derivatives have excellent thermal conductivity, and are common additives for metal-based nanocomposites. However, the easy aggregation of graphene and metal nanoparticles severely limits uniform mixing, and hinders development and performance improvement of metal/graphene composites. Herein, we developed a dual-dispersion medium method to fabricate a silver–graphene oxide (Ag/GO) composite with high thermal/electrical conductivity and mechanical performance. Through the method, GO and silver particles are dispersed evenly in different media and then fully mixed, thereby GO sheets can be uniformly dispersed and form a network in the matrix of silver particles. By adding a low GO content of 0.2 wt%, the density of the sintered Ag/GO joint increased from 9.0 to 9.5 g/cm3, the shear strength increased from 45.8 to 71.9 MPa, the thermal conductivity increased from 234.2 to 375.2 W/(m·K), and the electrical resistivity reduced from 4.6 to 1.9 μΩ cm. The added GO sheets form a coating layer with good interfacial bonding on the surface of most silver particles and form a uniform network in the Ag matrix. In addition, the added GO sheets reduce the overall thermal expansion coefficient and agglomerate size, thereby improving the sintering density and heat transfer efficiency of the Ag/GO composite. Because of its comprehensive properties, the Ag/GO composite material in this study exhibits good potential as a heat dissipation material for packaging and interconnect applications of high-power-density electronic devices. |
| format | Article |
| id | doaj-art-ea0b827d2dda40e18f158d87bd499b16 |
| institution | OA Journals |
| issn | 2238-7854 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-ea0b827d2dda40e18f158d87bd499b162025-08-20T01:57:20ZengElsevierJournal of Materials Research and Technology2238-78542024-11-01338211822110.1016/j.jmrt.2024.11.163Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium methodHegeng Wei0Zexi Zhang1Zebo Li2Linfeng Peng3Guannan Yang4Tianshuo Zhao5Yu Zhang6Guanghan Huang7Chengqiang Cui8State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, China; School of Artificial Intelligence and Smart Manufacturing, Hechi University, Yizhou, 546300, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, China; Corresponding author.Department of Electrical & Electronic Engineering, The University of Hong Kong, Hongkong, 999077, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, China; Corresponding author.State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, ChinaGraphene and its derivatives have excellent thermal conductivity, and are common additives for metal-based nanocomposites. However, the easy aggregation of graphene and metal nanoparticles severely limits uniform mixing, and hinders development and performance improvement of metal/graphene composites. Herein, we developed a dual-dispersion medium method to fabricate a silver–graphene oxide (Ag/GO) composite with high thermal/electrical conductivity and mechanical performance. Through the method, GO and silver particles are dispersed evenly in different media and then fully mixed, thereby GO sheets can be uniformly dispersed and form a network in the matrix of silver particles. By adding a low GO content of 0.2 wt%, the density of the sintered Ag/GO joint increased from 9.0 to 9.5 g/cm3, the shear strength increased from 45.8 to 71.9 MPa, the thermal conductivity increased from 234.2 to 375.2 W/(m·K), and the electrical resistivity reduced from 4.6 to 1.9 μΩ cm. The added GO sheets form a coating layer with good interfacial bonding on the surface of most silver particles and form a uniform network in the Ag matrix. In addition, the added GO sheets reduce the overall thermal expansion coefficient and agglomerate size, thereby improving the sintering density and heat transfer efficiency of the Ag/GO composite. Because of its comprehensive properties, the Ag/GO composite material in this study exhibits good potential as a heat dissipation material for packaging and interconnect applications of high-power-density electronic devices.http://www.sciencedirect.com/science/article/pii/S2238785424026917Heat dissipationGraphene-metal compositeInterconnect materialSilver solder pasteThird-generation semiconductor |
| spellingShingle | Hegeng Wei Zexi Zhang Zebo Li Linfeng Peng Guannan Yang Tianshuo Zhao Yu Zhang Guanghan Huang Chengqiang Cui Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method Journal of Materials Research and Technology Heat dissipation Graphene-metal composite Interconnect material Silver solder paste Third-generation semiconductor |
| title | Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method |
| title_full | Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method |
| title_fullStr | Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method |
| title_full_unstemmed | Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method |
| title_short | Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method |
| title_sort | silver graphene oxide composite with high thermal electrical conductivity and mechanical performance developed through a dual dispersion medium method |
| topic | Heat dissipation Graphene-metal composite Interconnect material Silver solder paste Third-generation semiconductor |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424026917 |
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