Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration
Convergence of multiple functions in a single device is the main thought behind the development of the current electronic trends. So, the requirement for higher integration in electronic devices has become more important in present days than in the past. Through silicon via (TSV) is the latest inter...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2015-01-01
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| Series: | International Journal of Antennas and Propagation |
| Online Access: | http://dx.doi.org/10.1155/2015/470952 |
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